Molded silicone products FAQ

- Mar 30, 2018-

In some of our silicone products factories, the processing of silicone products, especially the development of new products, will encounter such problems that we cannot accurately estimate one by one. This requires a continuous trial of the product and a re-experiment. Until the product is completely conducive to production. In the following, we will share some common problems in moulded silicone products so that everyone can understand some of the difficulties in the production of silica gel processing plants, so that the cooperation of both parties can be carried out with pleasure.

    The following are the nine most common questions. To understand this, you can also help in the processing of silicone products or the production of silicone products by silicone products factories. We have a profound understanding and thank you all. Below, please take a look at what are the 9 common problems. If you don't understand it, look it over several times, and try it out by breaking it. There are no problems in the world, and the problems are man-made;

   1, lack;

    Produce causes and solutions.


    Molding material curing is not complete, the mold temperature is too high, so that a certain component of the material is vaporized or decomposed, the mold temperature is increased or the holding time is prolonged, and the mold temperature is decreased;

    3, lack of material;

    The mold clearance is too large or the overflow hole is too large, the amount of release agent is too much, the operation is too slow or too fast, adjust the mold fit tolerance and overflow hole size, adjust the appropriate mold temperature and pressurization timing;

    4, burning;

    The air is trapped in the billet, and the temperature is increased after compression to decompose the resin. An effective deflation operation is used to extend the closing time and reduce the mold temperature.

    5, warping;

  The curing is not complete, the die-out process is not proper, the material shrinkage is too high, the curing conditions are improved, and the die is redesigned so that the ejection device is reasonable. As much as possible after the uniform cooling out of the mold. Use shrink fasteners (shaper);

    6, the surface of the lusterless;

     Mold temperature is too high or too low

    7, stick mold;

   Rough mold surface, adjust mold temperature, generally reduce mold temperature properly, use suitable mold release agent, improve mold surface finish, should be chrome plating, molding material without adding mold release agent or improper addition, mold surface roughness or new mold without grinding Use, press the pressure is too high, through the test by adding an appropriate amount of effective internal release agent, improve the mold surface finish, available pressure mold powder try mold and then press the glass fiber, reduce the pressure properly;

    8, mottled surface

     Die overheat

     The pigment decomposes due to overheating, reduces the mold temperature and lowers the curing temperature.

    9, pinhole;

     Insufficient material thickening

    Local fiber content is too high, the surface air cannot escape, the amount of material is insufficient, the thickening degree of the material is increased, the uniformity of the material is increased, the feeding area is reduced, the forming pressure is increased, and the amount of material used is increased;